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In the modern world of electronics, IC or Integrated Circuit is a very known term. Integrated circuits are used in almost all types of equipment of our usage and revolutionize the electronic world.

It is widely used in computers, microwaves, play stations, automotive controls, airplanes, mobile phones, cameras, laptops, and many more. VLSI or Very Large Scale Integration is a renowned and widely used technology for integrated circuits and microchip processors.

It is a successor to LSI (Large scale integration), MSI (Medium-scale integration), and SSI (Small scale integration) technologies. Students bestowed with the responsibility of doing a task on this topic can take the expert Integrated Circuit assignment assistance of BookMyEssay and also Very Large Scale Integration assignment help. Before going into depth about the topic it is important to know what VLSI means.


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Meaning of the Term VLSI

VLSI is the abbreviated term of Very Large Scale Integration. It is the process of integrating a large number of transistors on a single silicon semiconductor microchip. In simple words, it is said that it is the process of creating an integrated circuit (IC) by embedding millions of transistors in a single microchip. The microcontroller and the microprocessor are the two of the most common devices of VLSI.

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Advantages of Using VLSI in Different Applications:

As Very Large Scale Integration created integrated circuits are widely used in different applications, it has many advantages. Some of the advantages are mentioned below:

  • Reduced size of the circuits.
  • Consumes less power than discrete components
  • Device reliability is higher
  • Increasing cost-effectiveness for devices 
  • Promotes miniaturization which is why requires less space
  • Improved performance of circuits in terms of the operating speed

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The Process of Designing a VLSI IC

The process of designing an integrated service incorporated two stages.

Front-End Design: This stage includes digital design with the help of a hardware description language, such as System Verilog, Verilog, and VHDL. Design verification via simulation and other verification techniques are confined in this stage. The whole process of Front-End design incorporates designing, starting from the gates and continuing through to design for testability.

  • Problem specification: The key parameters are addressed such as techniques of design, performance, functionality, physical dimensions, and fabrication technology. The final specifications include the power, speed, and size of the VLSI system and its functionality.
  • Architecture definition: Fundamental specifications such as floating-point units and the required system to use are included in this step.
  • Functional design: Vital functional units of a system are recognized and identification of each unit’s physical and electrical specifications are enabled.
  • Logic design: Control flow, word width, Boolean expressions, and allocation of the register are involved in this stage.
  • Circuit design: As it is a software step, it helps to utilize simulation to check the result.
  • Physical design: This step involves creating a layout by transforming the netlist into a geometrical depiction.


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Back-End Design: It consists of CMOS (Complementary metal-oxide-semiconductor) library design, characterization, fault simulation, and physical design. The entire process involves a step-by-step approach.

  • Wafer processing: In this step silicon crystals are manufactured and cut into discs or wafers before polishing and orientation of the crystal.
  • Lithography: Masking with photo etching and a photographic mask are included in this process and finally the wafer is exposed to ultraviolet light.
  • Etching: Here, removing material selectively from the surface of the wafer for producing patterns.
  • Ion Implantation: It is a method to achieve a desired electrical characteristic in the semiconductor that means a process to add dopants.
  • Metallization: in this step, a thin layer of aluminum is applied over the wafer.
  • Assembly packaging: As one wafer contains hundreds of chips, that is why a diamond saw cut the wafers into single chips. Finally, the chips are packaged after final inspection.

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